Flip chip technologies

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Publisher
McGraw-Hill
Publication Date
c1996
Language
English

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Subjects

Subjects
Design and construction
Integrated circuits
Integrated circuits -- Very large scale integration -- Design and construction
Microelectronic packaging
Multichip modules (Microelectronics)
Multichip modules (Microelectronics) -- Design and construction
Very large scale integration

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Contributors
Lau, John H
ISBN
9780070366091

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